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BGA SOPµî °¢Á¾ ICÀç»ý¿¡¼­ TEST±îÁö! ºÒ·®Àü¹®¼ö¸®!
C&P TECH  psk1911@naver.com 2014-07-10 2085
REBALLING / REWORK °¢Á¾ ICÀç»ý Àü¹®¼ö¸® C&P TECH BGA, CSP, FLIP CHIP, ÅÍÄ¡IC, REBALLING & REWORK IC Àç»ý BGA, CSP ´Â ¹°·Ð FPCB,ÅÍÄ¡IC¼ö¸® ÇØ µå¸®¸ç °¢Á¾ IC ¹× °¢Á¾ ºÒ·® ¼ö¸® ¸± ÆÐÅ·±îÁö Áö¿øÇØ µå¸³´Ï´Ù. SMDºÎÇ° Àç»ý(QFP,SOP,ÅÍÄ¡IC)&CSP, BGA REBALLING (2000EA/day) BGA REWORK (200EA/day) Æó º¸µå¿¡¼­ ÇÊ¿äÇÑ IC ¸¦ ¶¼¾î³»¾î ¾ð´õÇÊ Á¦°Å Àç»ý ¸®ÆÑÅ·ÇÏ¿© °ø±ÞÇÏ´Â ¾÷ü ÀÔ´Ï´Ù. Á¾·ù´Â BGA, CSP, QFP, SOP, PINTYPE, ÅÍÄ¡ICµî. ¼ö¸® ÈÄ SMT½ÇÀå ÇÒ ¼ö ÀÖ°Ô ÇØ µå¸³´Ï´Ù. [ Ãë ±Þ Ç° ¸ñ ] ¢¹ Micro BGA, CSP, ÅÍÄ¡IC, BGAÀÇ REPAIR ¹× REBALLING ¼ö¸®°ø±ÞÇÕ´Ï´Ù. ¢¹ QFP, SOP, PLCC, MODULE, ÅÍÄ¡IC(¾ð´õÇÊ Á¦°Å ¹× ¸±ÆÐÅ·) Àç»ý ¹× ¸®ÆÑÅ· ¢¹ CAMERA MODULEÀç»ý ¹× À̹ÌÁö ¼¾¼­ Àç»ý/°¢Á¾ ºÒ·® °øÀ¯ ¼ö¸® ¢¹ FLIP CHIP REWORK / Àç»ý °¢Á¾ BOARD ÆÐÅÏ OPEN¼ö¸® °¡´É! * Ÿ»ç ´ëºñ °¡°Ý ¹× Ç°Áú ¶ÇÇÑ º¸ÀåÇÕ´Ï´Ù. * C&P TECH¿¡ ¿¬¶ô ÁÖ½Ã¸é ¼º½É ¼ºÀÇ°Í ´äº¯ÇØ µå¸®°Ú½À´Ï´Ù. ¾à¼Óµå¸³´Ï´Ù. * BGA REBALLING½Ã BALL Àü¼ö °Ë»ç¸¦ Çö¹Ì°æÀ¸·Î öÀúÈ÷ ½Ç½ÃÇÏ°í ÀÖ½À´Ï´Ù. * ¾ð´õÇÊ µÇ¾îÀÖ´Â °¢Á¾ IC¶ÇÇÑ ±ò²ûÈ÷ ÀÛ¾÷ ÇØ µå¸®¸ç ¸± ÆÐÅ·¶ÇÇÑ Áö¿øÇØ µå¸³´Ï´Ù. ¡Ú Ãë ±Þ Àå ºñ ¡Ú - PB FREE SOLDER PASTE / JEL TYPE FLUX ±âŸ ºÎÀÚÀç. - HOT PLATE ´ëÇü ¼ÒÇü ÁÖ¹® Á¦ÀÛ °¡´ÉÇÏ¸ç ¿øÇÏ´Â ½ºÆåÀ¸·Î Á¦ÀÛ °¡´ÉÇÕ´Ï´Ù. - BGA REBALLING JIG ÁÖ¹®Á¦ÀÛ ¹× ÀÛ¾÷Áö¿ø ÀÌ °¡´ÉÇÕ´Ï´Ù. - REFLOW PROFILE CHECKER(¿Âµµ ÇÁ·ÎÆÄÀÏ ÃøÁ¤Àåºñ)ÀÌ¿ëÇÏ¿© È¿À²ÀûÀ¸·Î ÀÛ¾÷ÁøÇà. - BGA & SMD REWORK TOTAL SOIUTION - X-RAY M/C(Áß°í ½ÅÇ° ÆǸÅ) Áß°íÀåºñ ´Â ³ª¿À´Â Áï½Ã ÆǸŰ¡ ¿Ï·áµË´Ï´Ù. - ½Å±ÔSMT LINE¿¡¼­ Àû¿ëÇÏ´Â ¼³ºñ ¹× ±â°è ºÎÀÚÀç(°¢Á¾ ¼Ò¸ðÇ°) - BGA REBALLING SYSTEMD¿Ü SOCKET ¹× JIG(IC TEST ¹× ±¸µ¿°Ë»ç) - PCB FLUX ¼¼Ã´Á¦·ù(°¢Á¾ ¼¼Ã´Á¦·ù) - CHIP COUNTER / Á¦½ÀÇÔ / è¹ö(OVEN) / ÃÊÀ½Æļ¼Ã´±â µî ±âŸ ¸ðµç°ÍÀÌ ÁغñµÇ¾î ÀÖ½À´Ï´Ù! - ¿¬¶ôó : ¹Ú¼±±Ô°úÀå 010-9132-3086 cnp_tech@naver.com / psk1911@nate.com - »ó È£ : C&P TECH(¾¾¿£ÇÇÅ×Å©) TEL : 032-554-6500 FAX : 032-554-6501 - À§ Ä¡ : ÀÎõ½Ã °è¾ç±¸ È¿¼ºµ¿ 34-42 »ï¼ººôµù 401È£ ~ 501È£ C&P TECH
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